Publication deliverables

Book of projects
D1.1 - Report on end-user specifications
D2.1 - Report on round-robin testing of LEDs
D2.2 - Report on the round-robin tests of LED packages (goniometric)
D2.4 - Report on the LED package characterization work
D2.6 - Report on the Characterization of the demonstrator system(s)
D3.1 - Report on LED package compact thermal modelling
D3.2 - Report on Spice-like multi-domain modelling of LEDs on chip level
D3.3 - Report on parameter extraction for Spice- like chip level multi- domain LED models
D3.4 - Report on Spice- like modelling of LEDs integrated into a complex 3D environment
D3.5 - Report on mixed detailed and compact modelling of large area LED devices
D3.6 - Report on variability causes, ranking per user need, and impact on model deviations
D4.1 - Mid-term status report on different standardization activities
D4.2 - Final report on the different standardization activities
D5.1 - Website
D5.3 - Initial dissemination plan
D5.6 - XML Schema for Compact Model Data Exchange, Created and Described (M36)