IEEE ITherm Conference 2018

Welcome to ITherm 2018
The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems

Sponsored by the IEEE’s Electronic Packaging Society (EPS), ITherm 2018 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The first ITherm Conference was held in 1988, making this the 30th year of the Conference Series.

May 29 – June 1, 2018